PLEASE NOTE: Due to the extremely low hardness of thermally conductive pads, a more demanding installation is to be expected. Please refer to the User Manual
MINIMIZATION OF THERMAL RESISTANCE: The thinner the pad, the lower the thermal resistance. Thanks to its good compression properties, the very soft heat conduction pad is particularly a good heat conductor
HIGH PERFORMANCE: Based on silicone and a special filler, TP-3 also outperforms high-performance pads, especially when height differences of closely spaced chips
VERSATILE APPLICATIONS: Heat-conducting, vibration-damping, mouldable, electrically insulating - can be easily cut to size. Ideal for RAM, chipset, IC in PC, laptop, console, graphic cards
SAFE HANDLING: The pad contains no metal particles, is electrically insulating and non-capacitive. Handling is therefore safe, as contact with electrical parts will not cause damage
